Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD) of Copper-Based Metallization for Microelectronic Fabrication
Publication information:
Au, Yeung, Youbo Lin, Hoon Kim, Zhengwen Li, and Roy Gordon. “Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD) of Copper-Based Metallization for Microelectronic Fabrication”. Proceedings of the AVS Atomic Layer Deposition Conference, 2011, 1-19.