Chemical Vapor Deposition of Cobalt Nitride and Its Application as an Adhesion-Enhancing Layer for Advanced Copper Interconnects
Publication information:
Bhandari, Harish, Jing Yang, Hoon Kim, Youbo Lin, Roy Gordon, Qing Min Wang, Jean-Sebastien Lehn, Huazhi Li, and Deo Shenai. “Chemical Vapor Deposition of Cobalt Nitride and Its Application As an Adhesion-Enhancing Layer for Advanced Copper Interconnects”. ECS Journal of Solid State Science and Technology 1, no. 5 (2012): N79-N84.