Filling Narrow Trenches by Iodine-Catalyzed CVD of Copper and Manganese on Manganese Nitride Barrier/Adhesion Layers
Publication information:
Au, Yeung, Youbo Lin, and Roy Gordon. “Filling Narrow Trenches by Iodine-Catalyzed CVD of Copper and Manganese on Manganese Nitride Barrier Adhesion Layers”. Journal of The Electrochemical Society 158, no. 5 (2011): D248-D253.