First-Principles Simulations of Conditions of Enhanced Adhesion Between Copper and TaN(111) Surfaces Using a Variety of Metallic Glue Materials
Publication information:
Han, Bo, Jinping Wu, Ghenggang Zhou, Bei Chen, Roy Gordon, Xinjian Lei, David Roberts, and Hansong Cheng. “First-Principles Simulations of Conditions of Enhanced Adhesion Between Copper and TaN(111) Surfaces Using a Variety of Metallic Glue Materials”. Angewandte Chemie, International Edition 49, no. 1 (2010): 148-52.