Nucleation and Adhesion of ALD Copper on Cobalt Adhesion Layers and Tungsten Nitride Diffusion Barriers
Publication information:
Li, Zhengwen, Roy Gordon, Damon Farmer, Youbo Lin, and Joost Vlassak. “Nucleation and Adhesion of ALD Copper on Cobalt Adhesion Layers and Tungsten Nitride Diffusion Barriers”. Electrochemical and Solid-State Letters 8, no. 7 (2005): G182-G185.