Selective Chemical Vapor Deposition of Manganese Self-Aligned Capping Layer for Cu Interconnections in Microelectronics
Publication information:
Au, Yeung, Youbo Lin, Hoon Kim, Eugene Beh, Yiqun Liu, and Roy Gordon. “Selective Chemical Vapor Deposition of Manganese Self-Aligned Capping Layer for Cu Interconnections in Microelectronics”. Journal of The Electrochemical Society 157, no. 6 (2010): D341-D345.