Ultrathin CVD Cu Seed Layer Formation Using Copper Oxynitride Deposition and Room Temperature Remote Hydrogen Plasma Reduction
Publication information:
Kim, Hoon, Harish Bhandari, Sheng Xu, and Roy Gordon. “Ultrathin CVD Cu Seed Layer Formation Using Copper Oxynitride Deposition and Room Temperature Remote Hydrogen Plasma Reduction”. Journal of The Electrochemical Society 155, no. 7 (2008): H496-H503.