Vapor Deposition of Highly Conformal Copper Seed Layers for Plating Through-Silicon Vias (TSVs)
Publication information:
Au, Yeung, Qing Min Wang, Huazhi Li, Jean-Sebastien Lehn, Deo Shenai, and Roy Gordon. “Vapor Deposition of Highly Conformal Copper Seed Layers for Plating Through-Silicon Vias (TSVs)”. Journal of The Electrochemical Society 159, no. 6 (2012): D382-D385.